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(R)
STPS15L30CB
LOW DROP POWER SCHOTTKY RECTIFIER
MAIN PRODUCTS CHARACTERISTICS IF(AV) VRRM Tj (max) VF (max) 2 x 7.5 A 30 V 150 C 0.39 V
K
A2 A1 K
FEATURES AND BENEFITS VERY SMALL CONDUCTION LOSSES NEGLIGIBLE SWITCHING LOSSES EXTREMELY FAST SWITCHING LOW FORWARD VOLTAGE DROP HIGH AVALANCHE CAPABILITY LOW THERMAL RESISTANCE AVALANCHE CAPABILITY SPECIFIED
s s s s s s s
A2 A1
DPAK
DESCRIPTION Dual center tab Schottky rectifier suited for switch Mode Power Supply and high frequency DC to DC converters. Package in DPAK, this device is intended for use in low voltage, high frequency inverters, free-wheeling and polarity protection applications. ABSOLUTE RATINGS (limiting values, per diode) Symbol VRRM IF(RMS) IF(AV) IFSM IRRM PARM Tstg Tj dV/dt Parameter Repetitive peak reverse voltage RMS forward current Average forward current Surge non repetitive forward current Peak repetitive reverse current Repetitive peak avalanche power Storage temperature range Maximum operating junction temperature * Critical rate of rise reverse voltage Tc = 140C = 0.5 Per diode Per device Value 30 10 7.5 15 75 1 2800 - 65 to + 175 150 10000 A A A W C C V/s Unit V A
tp = 10 ms sinusoidal tp=2 s square F=1kHz tp = 1s Tj = 25C
*:
dPtot 1 thermal runaway condition for a diode on its own heatsink < dTj Rth( j - a )
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July 2003 - Ed : 2A
STPS15L30CB
THERMAL RESISTANCES Symbol Rth(j-c) Rth(c) Junction to case Coupling Parameter Per diode Total Value 4 2.4 0.7 Unit C/W
When the diodes 1 and 2 are used simultaneously : Tj(diode 1) = P(diode1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c)
STATIC ELECTRICAL CHARACTERISTICS (per diode) Symbol IR * Parameter Reverse leakage current Tests Conditions Tj = 25C Tj = 125C VF * Forward voltage drop Tj = 25C Tj = 125C Tj = 25C Tj = 125C Tj = 25C Tj = 125C
Pulse test : * tp = 380 s, < 2%
Min.
Typ.
Max. 1
Unit mA mA V
VR = VRRM 70 IF = 7.5 A IF = 7.5 A IF = 12 A IF = 12 A IF = 15 A IF = 15 A 0.44 0.40 0.34
140 0.48 0.39 0.53 0.47 0.57 0.51
To evaluate the conduction losses use the following equation : P = 0.27 x IF(AV) + 0.016 IF2(RMS)
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STPS15L30CB
Fig. 1: Conduction losses versus average current.
PF(av)(W)
4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0 1 2 3 4 5 6 7
T
Fig. 2: Average forward current versus ambient temperature ( = 0.5).
IF(av)(A)
9
= 0.5 = 0.2 = 0.1 = 0.05 =1
8 7 6 5 4 3 2 1
T
Rth(j-a)=Rth(j-c)
Rth(j-a)=70C/W
IF(av)(A)
=tp/T
8 9
tp
0
=tp/T
0 25
tp
Tamb(C)
50 75 100 125 150
10
Fig. 3: Normalized avalanche power derating versus pulse duration.
PARM(tp) PARM(1s)
1
Fig. 4: Normalized avalanche power derating versus junction temperature.
PARM(tp) PARM(25C)
1.2 1
0.1
0.8 0.6
0.01
0.4 0.2
0.001
0.01 0.1 1
tp(s)
10 100 1000
Tj(C)
0 0 25 50 75 100 125 150
Fig. 5: Non repetitive surge peak forward current versus overload duration (maximum values).
IM(A)
100 90 80 70 60 50
Tc=75C Tc=25C
Fig. 6: Relative variation of thermal impedance junction to case versus pulse duration.
Zth(j-c)/Rth(j-c)
1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3
= 0.2 = 0.1 = 0.5
40 30
Tc=125C
20 10 0
T
IM t
0.2
Single pulse
=0.5
t(s)
1.E-02 1.E-01 1.E+00
0.1 0.0 1.E-03 1.E-02
tp(s)
1.E-01
=tp/T
tp
1.E-03
1.E+00
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STPS15L30CB
Fig. 7: Reverse leakage current versus reverse voltage applied (typical values).
IR(mA)
1.E+03
Tj=150C
Fig. 8: Junction capacitance versus reverse voltage applied (typical values).
C(nF)
10.0
F=1MHz Vosc=30mV Tj=25C
1.E+02
Tj=125C
1.E+01
Tj=100C
1.0
Tj=75C
1.E+00
Tj=50C
1.E-01
Tj=25C
VR(V)
1.E-02 0 5 10 15 20 25 30
0.1 1
VR(V)
10 100
Fig. 9: Forward voltage drop versus forward current.
Fig. 10: Thermal resistance junction to ambient versus copper surface under tab (epoxy printed board FR4, Cu = 35m).
Rth(j-a)(C/W)
100 90 80
IFM(A)
100
Tj=125C (Maximum values)
70 60 50 40
Tj=25C (Maximum values)
10
Tj=125C (Typical values)
30 20
VFM(V)
1 0.0 0.2 0.4 0.6 0.8 1.0 1.2
10 0 0 2 4 6 8
S(cm)
10 12 14 16 18 20
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STPS15L30CB
PACKAGE MECHANICAL DATA DPAK DIMENSIONS REF. A A1 A2 B B2 C C2 D E G H L2 L4 V2 Millimeters Min. Max 2.20 2.40 0.90 1.10 0.03 0.23 0.64 0.90 5.20 5.40 0.45 0.60 0.48 0.60 6.00 6.20 6.40 6.60 4.40 4.60 9.35 10.10 0.80 typ. 0.60 1.00 0 8 Inches Min. Max. 0.086 0.094 0.035 0.043 0.001 0.009 0.025 0.035 0.204 0.212 0.017 0.023 0.018 0.023 0.236 0.244 0.251 0.259 0.173 0.181 0.368 0.397 0.031 typ. 0.023 0.039 0 8
FOOTPRINT (dimensions in mm)
6.7
6.7
3 3 1.6 2.3 2.3 1.6
Ordering type STPS15L30CB STPS15L30CB-TR
s
Marking S15L30C S15L30C
Package DPAK DPAK
Weight 0.30 g 0.30 g
Base qty 75 2500
Delivery mode Tube Tape & reel
EPOXY MEETS UL94,V0
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics (c) 2003 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - Finland - France - Germany Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore Spain - Sweden - Switzerland - United Kingdom - United States. http://www.st.com 5/5

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